Cleanroom-compatible automation for stable processes in semiconductor production

Semiconductor manufacturing operates under constant pressure: high quality requirements, sensitive materials, and tight schedules. Our systems for Smart Semiconductor Fabrication offer high-precision automation that optimizes your wafer production and ensures your competitive edge. From polishing processes to packaging, we rethink semiconductor manufacturing.

Cleanroom-compatible automation for stable processes in semiconductor production

Semiconductor manufacturing operates under constant pressure: high quality requirements, sensitive materials, and tight schedules. Our systems for Smart Semiconductor Fabrication offer high-precision automation that optimizes your wafer production and ensures your competitive edge. From polishing processes to packaging, we rethink semiconductor manufacturing.

SMART SEMICON FAB

Cleanroom automation for stable semiconductor processes

Semiconductor manufacturing operates under constant pressure: high quality requirements, sensitive materials, and tight schedules. Our systems for Smart Semiconductor Fabrication offer high-precision automation that optimizes your wafer production and ensures your competitive edge. From polishing processes to packaging, we rethink semiconductor manufacturing.

Secure independence

Customized machines reduce reliance on global supply chains

Strengthen market competitiveness

Flexible systems enable quick adjustments to market changes

Optimize costs

Resource-efficient technologies lower material and energy costs

Secure independence

Customized machines reduce reliance on global supply chains

Strengthen market competitiveness

Flexible systems enable quick adjustments to market changes

Optimize costs

Resource-efficient technologies lower material and energy costs

Secure independence

Customized machines reduce reliance on global supply chains

Strengthen market competitiveness

Flexible systems enable quick adjustments to market changes

Optimize costs

Resource-efficient technologies lower material and energy costs

APOLLU

Automated handling for polishing and lapping processes

Handling wafers during the polishing and lapping processes is a critical point in semiconductor manufacturing. It determines whether your products achieve the highest surface quality and dimensional accuracy. At the same time, manual interventions pose a high risk of damage and contamination.


Apollu addresses this challenge: with a camera-based positioning system that automatically detects and handles wafers with high precision, and a fast cycle time, it ensures maximum efficiency and process reliability. The solution integrates seamlessly into your existing production line and supports wafer sizes from 150 to 300 mm, regardless of the machine manufacturer.


Apollu meets ISO-7 standards for cleanroom operations and offers a quick setup time to flexibly respond to changing production requirements. The result: stability, quality, and a significant relief for your employees.

APOLLU

Automated handling for polishing and lapping processes

Handling wafers during the polishing and lapping processes is a critical point in semiconductor manufacturing. It determines whether your products achieve the highest surface quality and dimensional accuracy. At the same time, manual interventions pose a high risk of damage and contamination.


Apollu addresses this challenge: with a camera-based positioning system that automatically detects and handles wafers with high precision, and a fast cycle time, it ensures maximum efficiency and process reliability. The solution integrates seamlessly into your existing production line and supports wafer sizes from 150 to 300 mm, regardless of the machine manufacturer.


Apollu meets ISO-7 standards for cleanroom operations and offers a quick setup time to flexibly respond to changing production requirements. The result: stability, quality, and a significant relief for your employees.

Safe wafer transport

Camera-based positioning prevents damage

Higher throughput

Fast loading and unloading with a <20-second cycle time

Cleanroom compliance

ISO-7 standards ensure a clean work environment

Maximum diversity

Supports various wafer sizes and machine types

APOLLU

Automated handling for polishing and lapping processes

Apollu addresses this challenge: with a camera-based positioning system that automatically detects and handles wafers with high precision, and a fast cycle time, it ensures maximum efficiency and process reliability. The solution integrates seamlessly into your existing production line and supports wafer sizes from 150 to 300 mm, regardless of the machine manufacturer.


Apollu meets ISO-7 standards for cleanroom operations and offers a quick setup time to flexibly respond to changing production requirements. The result: stability, quality, and a significant relief for your employees.

Safe wafer transport

Camera-based positioning prevents damage

Higher throughput

Fast loading and unloading with a cycle time of <20 seconds

Cleanroom compliance

Fast loading and unloading with a <20-second cycle time

Maximum diversity

Supports various wafer sizes and machine types

AUTO BAGGING TOOL (ABT)

Fully automated packaging system for FOSBs, FOUPs & other wafer boxes

Packaging Front-Opening Shipping Boxes (FOSBs) and Front-Opening-Universal-Pods (FOUPs) is a critical step in semiconductor manufacturing, where high precision and safety are required. Our ABT system automates the entire packing process - from identification and leak testing to labeling, ensuring error-free and efficient handling.


The ABT system uses Code identification, ensuring that each FOSB & FOUP is correctly assigned to the corresponding wafers. Automated checks, such as cross-slot checks and 100% leak tests, minimize the risk of transport damage. An integrated labeling system ensures that packing meets the highest standards and all information is properly documented.


Thanks to its SECS/GEM compatibility, the ABT system integrates seamlessly into existing production lines without requiring extensive adjustments. It is ideal for manufacturers who prioritize speed, safety, and cleanroom standards.

100% tightness guarantee

Protection for wafers through 100% leak testing

Optimised for large series

Minimal cycle times, handling up to 270 FOSBs per day

Guaranteed product quality

Cross-slot checks for precise quality control

Seamless data integration

Synchronization with host systems via SECS/GEM

MANUAL BAGGING TOOL (MBT)

Semi-automatic packaging for smaller FOSB & FOUP batches

The MBT system is designed for production lines that require flexibility to handle changing demands and smaller batches. Unlike the ABT system, MBT combines manual input with automated core processes, which is particularly useful for test batches, prototypes, and custom orders.


Thanks to its compact design and ease of use, the MBT system is ideal for companies looking to improve their packaging processes efficiently without large investment costs. Even for smaller quantities, it ensures the same high standards as mass production, including automated leak testing and flexible container adjustment.

Ideal test conditions

Ideal for prototypes, tests, & custom orders

Reduced costs

Semi-automatic processes reduce investment costs

User-friendly

Intuitive manual input for all requirements

Space-saving

Space-saving integration into production environments

SMART WAREHOUSE / MINI

Optimum storage of semiconductor components in limited space

Semiconductor production requires high precision, even when storing sensitive components like FOSB, FOUP, and wafer boxes.


Our Smart Warehouse / Mini is specifically designed to organize these critical materials in a space-saving and secure way. It offers fully automated inbound and outbound interfaces to accelerate material flow and enables real-time tracking of every container. Thanks to its modular design, it can be flexibly adjusted to meet growing demands and can fit into cleanroom environments when necessary.

Optimum protection

Safe handling of sensitive wafer boxes

Dynamic connections

Dynamic connections for inbound & outbound

Real-Time tracking

Tracking & tracing for accuracy in real-time

Seamless integration

Seamless integration into existing factory layouts

SMART WAREHOUSE / BIG

Maximum capacity for FOSB, FOUP and wafer boxes

Semiconductor production is under increasing pressure to keep up with global competition while maintaining the highest quality and efficiency standards.


With our Smart Warehouse / Big, we help companies reliably supply their production lines with FOSB, FOUP, and wafer boxes — even with increasing demands and short delivery times.


With scalable capacities, automated material flows, and a space-saving design, we optimize your storage processes and minimize material shortages. This ensures your production remains flexible and efficient, even in a dynamic market environment.

Scalable storage capacities

Manage 400 to 2900+ units

(FOSB, FOUP, Wafer boxes)

Maximum flexibility

Min: 8,5m x 4,5m x 4,5m

Max: 20m x 4,5m x 8m

Efficient material transport

Integration with efficient OHT material transport systems

Automated logistics

Space-saving with advanced gripper technology

AUTO BAGGING TOOL (ABT)

Fully automated packaging system for FOSBs, FOUPs & other wafer boxes

Packaging Front-Opening Shipping Boxes (FOSBs) and Front-Opening-Universal-Pods (FOUPs) is a critical step in semiconductor manufacturing, where high precision and safety are required. Our ABT system automates the entire packing process - from identification and leak testing to labeling, ensuring error-free and efficient handling.


The ABT system uses Code identification, ensuring that each FOSB & FOUP is correctly assigned to the corresponding wafers. Automated checks, such as cross-slot checks and 100% leak tests, minimize the risk of transport damage. An integrated labeling system ensures that packing meets the highest standards and all information is properly documented.


Thanks to its SECS/GEM compatibility, the ABT system integrates seamlessly into existing production lines without requiring extensive adjustments. It is ideal for manufacturers who prioritize speed, safety, and cleanroom standards.

100% tightness guarantee

Protection for wafers through 100% leak testing

Optimised for large series

Minimal cycle times, handling up to 270 FOSBs per day

Guaranteed product quality

Cross-slot checks for precise quality control

Seamless data integration

Synchronization with host systems via SECS/GEM

MANUAL BAGGING TOOL (MBT)

Semi-automatic packaging for smaller FOSB & FOUP batches

The MBT system is designed for production lines that require flexibility to handle changing demands and smaller batches. Unlike the ABT system, MBT combines manual input with automated core processes, which is particularly useful for test batches, prototypes, and custom orders.


Thanks to its compact design and ease of use, the MBT system is ideal for companies looking to improve their packaging processes efficiently without large investment costs. Even for smaller quantities, it ensures the same high standards as mass production, including automated leak testing and flexible container adjustment.

Ideal test conditions

Ideal for prototypes, tests, & custom orders

Reduced costs

Semi-automatic processes reduce investment costs

User-friendly

Intuitive manual input for all requirements

Space-saving

Space-saving integration into production environments

SMART WAREHOUSE / MINI

Optimum storage of semiconductor components in limited space

Semiconductor production requires high precision, even when storing sensitive components like FOSB, FOUP, and wafer boxes.


Our Smart Warehouse / Mini is specifically designed to organize these critical materials in a space-saving and secure way. It offers fully automated inbound and outbound interfaces to accelerate material flow and enables real-time tracking of every container. Thanks to its modular design, it can be flexibly adjusted to meet growing demands and can fit into cleanroom environments when necessary.

Optimum protection

Safe handling of sensitive wafer boxes

Dynamic connections

Dynamic connections for inbound & outbound

Real-Time tracking

Tracking & tracing for accuracy in real-time

Seamless integration

Seamless integration into existing factory layouts

SMART WAREHOUSE / BIG

Maximum capacity for FOSB, FOUP and wafer boxes

Semiconductor production is under increasing pressure to keep up with global competition while maintaining the highest quality and efficiency standards.


With our Smart Warehouse / Big, we help companies reliably supply their production lines with FOSB, FOUP, and wafer boxes—even with increasing demands and short delivery times.


With scalable capacities, automated material flows, and a space-saving design, we optimize your storage processes and minimize material shortages. This ensures your production remains flexible and efficient, even in a dynamic market environment.

Scalable storage capacities

Manage 400 to 2900+ units

(FOSB, FOUP, Wafer boxes)

Maximum flexibility

Min: 8,5m x 4,5m x 4,5m

Max: 20m x 4,5m x 8m

Efficient material transport

Integration with efficient OHT material transport systems

Automated logistics

Space-saving with advanced gripper technology

Camera-based positioning prevents damage

Fast loading and unloading with a <20-second cycle time

ISO-7 standards ensure a clean work environment

Supports various wafer sizes and machine types

AUTO BAGGING TOOL (ABT)

Fully automated packaging system for FOSBs, FOUPs & other wafer carriers

Packaging Front-Opening Shipping Boxes (FOSBs) and Front-Opening-Universal-Pods (FOUPs) is a critical step in semiconductor manufacturing, where high precision and safety are required. Our ABT system automates the entire packing process - from identification and leak testing to labeling, ensuring error-free and efficient handling.


The ABT system uses Code identification, ensuring that each FOSB & FOUP is correctly assigned to the corresponding wafers. Automated checks, such as cross-slot checks and 100% leak tests, minimize the risk of transport damage. An integrated labeling system ensures that packing meets the highest standards and all information is properly documented.


Thanks to its SECS/GEM compatibility, the ABT system integrates seamlessly into existing production lines without requiring extensive adjustments. It is ideal for manufacturers who prioritize speed, safety, and cleanroom standards.

Protection for wafers through 100% leak testing

Minimal cycle times, handling up to 270 FOSBs per day

Cross-slot checks for precise quality control

Synchronization with host systems via SECS/GEM

MANUAL BAGGING TOOL (MBT)

Semi-automatic packaging for smaller FOSB & FOUP batches

The MBT system is designed for production lines that require flexibility to handle changing demands and smaller batches. Unlike the ABT system, MBT combines manual input with automated core processes, which is particularly useful for test batches, prototypes, and custom orders.


Thanks to its compact design and ease of use, the MBT system is ideal for companies looking to improve their packaging processes efficiently without large investment costs. Even for smaller quantities, it ensures the same high standards as mass production, including automated leak testing and flexible container adjustment.

Ideal for prototypes, tests, & custom orders

Semi-automatic processes reduce investment costs

Intuitive manual input for all requirements

Space-saving integration into production environments

SMART WAREHOUSE / MINI

Optimum storage of semiconductor components in limited space

Semiconductor production requires high precision, even when storing sensitive components like FOSB, FOUP, and wafer boxes.


Our Smart Warehouse / Mini is specifically designed to organize these critical materials in a space-saving and secure way. It offers fully automated inbound and outbound interfaces to accelerate material flow and enables real-time tracking of every container. Thanks to its modular design, it can be flexibly adjusted to meet growing demands and can fit into cleanroom environments when necessary.

Safe handling of sensitive wafer boxes

Dynamic connections for inbound & outbound

Tracking & tracing for accuracy in real-time

Seamless integration into existing factory layouts

SMART WAREHOUSE / BIG

Maximum capacity for FOSB, FOUP and wafer boxes

Semiconductor production is under increasing pressure to keep up with global competition while maintaining the highest quality and efficiency standards.


With our Smart Warehouse / Big, we help companies reliably supply their production lines with FOSB, FOUP, and wafer boxes—even with increasing demands and short delivery times.


With scalable capacities, automated material flows, and a space-saving design, we optimize your storage processes and minimize material shortages. This ensures your production remains flexible and efficient, even in a dynamic market environment.

Manage 400 to 2900+ units

(FOSB, FOUP, Wafer boxes)

Min: 8,5m x 4,5m x 4,5m

Max: 20m x 4,5 m x 8m

Integration with efficient OHT material transport systems

Space-saving with advanced gripper technology

Frequently Asked Questions (FAQs)

Do you have any additional questions about Smart Semiconductor Fabrication that we haven’t addressed on this page? Check out our FAQ section for answers to the most common questions about our products and services from the Smart Semicon Fab portfolio. Or feel free to contact us directly.

  • Why is automation so important in semiconductor manufacturing?

    The semiconductor industry faces constant pressure: high-quality requirements, sensitive materials, and tight schedules. Manual processes are prone to errors and inefficiency. Our Smart Semicon Fab solutions optimize the entire production process—from wafer handling to packaging—ensuring maximum precision, stability, and efficiency.

  • How does CTS help reduce our dependency on global supply chains?

    With custom machines and modular automation solutions, we create independence. Our solutions optimize your on-site processes, reduce material waste, and increase your manufacturing efficiency, reducing reliance on external suppliers.

  • Is your system flexible enough to adapt to future market changes?

    Yes! Our solutions are modular and scalable. You can expand existing systems, process new wafer sizes, and increase production capacity as needed—without major reinvestments.

  • Our biggest issue is the manual handling of wafers. How does Apollu prevent damage and contamination?

    Apollu uses camera-based, contactless detection and precise handling to capture and align wafers, minimizing breakage, scratches, and contamination that could occur with manual processes.

  • What wafer sizes does Apollu support?

    Apollu is compatible with wafers from 150 mm to 300 mm and can be integrated into your production line, regardless of the machine manufacturer.

  • How does Apollu improve our production speed?

    Apollu enables fast wafer loading and unloading in less than 20 seconds, increasing throughput, reducing downtime, and improving machine utilization.

  • Can Apollu be used in cleanroom environments?

    Yes, Apollu meets ISO-7 standards and is optimized for cleanroom operations, ensuring your production meets the highest quality and cleanliness requirements.

  • Our packaging processes are too slow and error-prone. How can the ABT system help?

    The ABT system automates the entire packaging process, from identification and leak testing to labeling. This eliminates errors, reduces packaging time, and prevents transport damage.

  • Is ABT designed for large production volumes?

    Yes! The ABT system is optimized for mass production and can package up to 270 FOSBs per day, significantly increasing efficiency.

  • Is the ABT system easy to integrate into existing production lines?

    Yes, ABT is SECS/GEM-compliant and can be seamlessly integrated into your existing host systems without major adjustments.

  • We deal with many small batches and custom orders—would MBT be a better choice than ABT?

    Exactly! MBT was specifically developed for small batches, test production, and prototypes. It combines manual input with automated core processes to provide maximum flexibility.

  • Can we save costs with MBT?

    Yes! The semi-automatic process reduces investment costs compared to fully automated packaging solutions and saves on labor costs.

  • How space-saving is the MBT system?

    MBT can be compactly integrated into existing production environments, requiring no extensive modifications.

  • How does the Smart Warehouse Mini help store sensitive wafer boxes safely?

    The system offers safe, dust-free storage for FOSB, FOUP, and wafer boxes and is specifically designed for the demands of semiconductor manufacturing.

  • We have limited space—will this system work for us?

    Yes! The Smart Warehouse Mini utilizes compact, high-density storage to provide maximum capacity in a small space.

  • How does it improve our material flow?

    Automated inbound and outbound interfaces accelerate material flow, ensuring that wafer boxes are always at the right place at the right time.

  • We have growing production demands—how does the Smart Warehouse Big scale with us?

    Our system is scalable from 400 to over 2,900 FOSBs and can be adapted to increasing production volumes as your needs grow.

  • Can we integrate the Big Smart Warehouse into our existing logistics?

    Yes, the system can be directly connected to OHT material transport systems (e.g., Murata or Hirata) to ensure a smooth logistics flow.

  • How does the system optimize our storage processes?

    With automated material flows, advanced gripper technology, and seamless integration into host systems, material shortages are prevented, and production remains efficient.

Focus on Smart Manufacturing

Discover how intelligent technologies enhance production efficiency, optimize material flows, and prepare businesses for the challenges of tomorrow.

Focus on Smart Manufacturing

Discover how intelligent technologies enhance production efficiency, optimize material flows, and prepare businesses for the challenges of tomorrow.

Focus on Smart Manufacturing

A row of robots are sitting in a factory.

Scalable automation for efficient electronics manufacturing

March 25, 2025
At this year’s IPC APEX EXPO in Anaheim, the cts group is presenting its solutions for the “Smart Electronics Factory” – scalable automation to optimize processes in electronics manufacturing.
A robotic arm is working on a machine in a factory.

New Technologies In Mechanical Engineering

March 7, 2025
For centuries, mechanical engineers have been developing new technologies that make our lives easier, more efficient and more comfortable. In recent years, new technologies in mechanical engineering have developed particularly rapidly.
A poster for semicon southeast asia is shown

cts AT SEMICON SEA 2024

March 7, 2025
The show brings together industry decision-makers, showcases the latest products, and delivers the latest market and technology trends.
Show More

Curious about more than automation?

A row of robots are sitting in a factory.

Scalable automation for efficient electronics manufacturing

March 25, 2025
At this year’s IPC APEX EXPO in Anaheim, the cts group is presenting its solutions for the “Smart Electronics Factory” – scalable automation to optimize processes in electronics manufacturing.
A robotic arm is working on a machine in a factory.

New Technologies In Mechanical Engineering

March 7, 2025
For centuries, mechanical engineers have been developing new technologies that make our lives easier, more efficient and more comfortable. In recent years, new technologies in mechanical engineering have developed particularly rapidly.
A poster for semicon southeast asia is shown

cts AT SEMICON SEA 2024

March 7, 2025
The show brings together industry decision-makers, showcases the latest products, and delivers the latest market and technology trends.
Show More

Curious about more than automation?

A row of robots are sitting in a factory.

Scalable automation for efficient electronics manufacturing

March 25, 2025
At this year’s IPC APEX EXPO in Anaheim, the cts group is presenting its solutions for the “Smart Electronics Factory” – scalable automation to optimize processes in electronics manufacturing.
A robotic arm is working on a machine in a factory.

New Technologies In Mechanical Engineering

March 7, 2025
For centuries, mechanical engineers have been developing new technologies that make our lives easier, more efficient and more comfortable. In recent years, new technologies in mechanical engineering have developed particularly rapidly.
Show More

Curious about more than automation?